NCP51400, NCV51400

www.onsemi.com

7

PACKAGE DIMENSIONS

DFN10, 3x3, 0.5P

CASE 506CL

ISSUE O

10X

SEATING

PLANE

L

D

E

0.10 C

A

A1

e

D2

E2

b

1

5

10

6

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS

MEASURED BETWEEN 0.25 AND 0.30 MM FROM THE

TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS

THE TERMINALS.

5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG

SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30

MICRONS ONTO BOTTOM SURFACE OF TERMINAL b.

6. FOR DEVICE OPN CONTAINING W OPTION, DETAIL B

ALTERNATE CONSTRUCTION IS NOT APPLICABLE.

B

A

0.10 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN ONE

REFERENCE

0.05 C

0.05 C

(A3)

C

10X

10X

0.10 C

0.05 C

A B

NOTE 3

K

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.20

0.30

D

3.00 BSC

D2

2.40

2.60

E

3.00 BSC

E2

1.40

1.60

e

0.50 BSC

L

0.25

0.45

L1

0.00

0.03

DETAIL A

2X

2X

DETAIL B

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

3.30

0.50

0.57

10X

DIMENSIONS: MILLIMETERS

0.32

2.70

PITCH

1.70

10X

1

PACKAGE

OUTLINE

RECOMMENDED

NOTE 4

K

0.25

−−−

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