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KAF-4301-AAA-JP-B2 Datasheet(PDF) 7 Page - ON Semiconductor

Part # KAF-4301-AAA-JP-B2
Description  FULL FRAME CCD IMAGE SENSOR
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

KAF-4301-AAA-JP-B2 Datasheet(HTML) 7 Page - ON Semiconductor

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KAF-4301 Image Sensor
www.truesenseimaging.com
Revision 2.1 PS-0038Pg7
H22
Sub
Vdd2
Vout2
Vss
Vdd1
Vout1
R
Vrd
Vog
H21
FD2
FD1
Vlg
H2
H1
Figure 2: Output Structure
Output Structure
The final gate of the horizontal register is split into two sections, φH21 and φH22 as shown in Figure 2. The split gate
structure allows the user to select either of the two output amplifiers. To use the high dynamic range single-stage
output (Vout1), φH22 is tied to a negative voltage to block charge transfer, and φH21 is tied to φH2 to transfer
charge. To use the high sensitivity two-stage output (Vout2), φH21 is tied to a negative voltage and φH22 is tied to
φH2. The charge packets are then dumped onto the appropriate floating diffusion output node whose potential varies
linearly with the quantity of charge in each packet. The amount of potential change is determined by the simple
expression Vfd = Q/Cfd. The translation from electrons to voltages is called the output sensitivity or charge-to-voltage
conversion. After the output has been sensed off-chip, the reset clock (φR) removes the charge from the floating
diffusion via the reset drain (VRD). This, in turn, returns the floating diffusion potential to the reference level
determined by the reset drain voltage.
IMAGE ACQUISITION
An image is acquired when incident light, in the form of photons, falls on the array of pixels in the vertical CCD register
and creates electron-hole pairs (or simply electrons) within the silicon substrate. This charge is collected locally by the
formation of potential wells created at each pixel site by induced voltages on the vertical register clock lines
(φV1, φV2). These same clock lines are used to implement the transport mechanism as well. The amount of charge
collected at each pixel is linearly dependent on light level and exposure time and non-linearly dependent on
wavelength until the potential well capacity is exceeded. At this point charge will 'bloom' into vertically adjacent pixels.
CHARGE TRANSPORT
Integrated charge is transported to the output in a two-step process. Rows of charge are first shifted line by line into
the horizontal CCD. 'Lines' of charge are then shifted to the output pixel by pixel. Referring to the timing diagrams in
Figure 8, integration of charge is performed with φV1 and φV2 held low. Transfer to the horizontal CCD begins when
φV1 is brought high causing charge from the φV1 and φV2 gates to combine under the φV1 gate. φV1 and φV2 now
are reversed in polarity causing the charge packets to 'spill' forward under the φV2 gate of the next pixel. The rising
edge of φV2 also transfers the first line of charge into the horizontal CCD. A second phase transition places the charge
packets under the φV1 electrode of the next pixel. The sequence completes when φV1 is brought low. Clocking of the
vertical register in this way is known as accumulation mode clocking. Next, the horizontal CCD transfersout the first
line of charge using traditional complementary clocking (using φH1 and φH2 pins) as shown. The falling edge of φH2
forces a charge packet over the output gate (OG) onto one of the output nodes (floating diffusion) that controls the
output amplifier. The cycle repeats until all lines are read.


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