TPS65261, TPS65261-1

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SLVSCD3B – DECEMBER 2013 – REVISED MAY 2014

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–55

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

-2000

2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

-500

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

PVIN1, PVIN2, PVIN3,VIN

4.5

18

V

LX1, LX2, LX3 (Maximum withstand voltage transient < 20 ns)

-0.8

18

V

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

-0.1

6.8

V

EN1, EN2, EN3, PGOOD, V7V, MODE, RESET, VDIV

-0.1

6.3

V

FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC

-0.1

3

V

Operating junction temperature

-40

85

°C

Operating junction temperature

-40

125

°C

7.4 Thermal Information

TPS65261

UNIT

RHB (32 PINS)

Junction-to-ambient thermal resistance

31.6

Junction-to-case (top) thermal resistance

23.4

Junction-to-board thermal resistance

6.1

°C/W

Junction-to-top characterization parameter

0.2

Junction-to-board characterization parameter

6.1

Junction-to-case (bottom) thermal resistance

0.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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