NIS5452 Series

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8

PACKAGE DIMENSIONS

WDFN10, 3x3, 0.5P

CASE 522AA

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

C

A

SEATING

PLANE

D

B

E

0.15 C

A3

A

A1

2X

2X

0.15 C

DIM

A

MIN

NOM

MAX

MILLIMETERS

0.70

0.75

0.80

A1

0.00

0.03

0.05

A3

0.20 REF

b

0.18

0.24

0.30

D

3.00 BSC

D2

2.45

2.50

2.55

E

3.00 BSC

1.75

1.80

1.85

E2

e

0.50 BSC

0.19 TYP

K

PIN ONE

REFERENCE

0.08 C

0.10 C

10X

A

0.10 C

NOTE 3

L

e

D2

E2

b

B

5

6

10X

1

K

10

10X

10X

0.05 C

0.35

0.40

0.45

L

TOP VIEW

SIDE VIEW

BOTTOM VIEW

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.1746

2.6016

1.8508

0.5000 PITCH

0.5651

10X

3.3048

0.3008

10X

DIMENSIONS: MILLIMETERS

ON Semiconductor and the

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