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61113-004 Datasheet(PDF) 1 Page - Micropac Industries |
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61113-004 Datasheet(HTML) 1 Page - Micropac Industries |
1 / 2 page MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 487-6918 www.micropac.com E-MAIL: optosales@micropac.com 8 - 14 61113 GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE (2N2369AUB) Mii OPTOELECTRONIC PRODUCTS DIVISION Features: • Hermetically sealed • Hermetically sealed 3 pin LCC • MIL-PRF-19500 screening available Applications: • Analog Switches • Signal Conditioning • Small Signal Amplifiers • High Density Packaging DESCRIPTION The 61113 is a N-P-N, general-purpose switching and amplifier transistor in a 3 pin leadless chip carrier package. All packages are hermetically sealed for high reliability and harsh environments. This device is available custom binned to customer specifications in commercial or screened to MIL-PRF-19500 up to JANS level. ABSOLUTE MAXIMUM RATINGS Collector-Base Voltage - VCBO ................................................................................................................................................. 40Vdc Collector-Emitter Voltage - VCEO.............................................................................................................................................. 15Vdc Collector-Emitter Voltage - VCES .............................................................................................................................................. 40Vdc Emitter-Base Voltage - VEBO................................................................................................................................................... 4.5Vdc Collector Current – IC(Peak)....................................................................................................................................................... 500mA Continuous Collector Current ................................................................................................................................................ 200mA Maximum Junction Temperature........................................................................................................................................... +200°C Operating Temperature (See part selection guide for actual operating temperature)............................................ -65°C to +125°C Storage Temperature............................................................................................................................................... -65°C to +200°C Lead Soldering Temperature (vapor phase reflow for 30 seconds) .......................................................................................215°C Package Dimensions Schematic Diagram ALL DIMENSIONS ARE IN INCHES [MILLIMETERS] ORIENTATION KEY 3 PLACES 1 2 3 0.105 [2.67] 0.085 [2.16] 0.125 [3.18] 0.115 [2.92] 1 B 2 3 E C 0.054[1.37] 0.046 [1.17] 0.024 [0.61] 0.016 [0.41] 0.036 [0.91] 0.024 [0.61] |
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