FCDN605

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MECHANICAL DETAILS

Table 6. MECHANICAL SPECIFICATIONS

Parameter

Condition

Unit

Composition

Silicon Wafer,

n+ Doped

Die Shape

Rectangular

Length (Stepping Size)

1260

mm

Width (Stepping Size)

1160

mm

BG Thickness

10

mils

Saw Street Widths (Space

between Devices on Wafer)

(Note 1)

40 (X−Direction)

40 (Y−Direction)

mm

Die Attach Pad Length

720

mm

Die Attach Pad Width

720

mm

Die Attach Pad (DAP)

Cu (Copper)

Backside Metal

Bare Silicon

1. The saw street is defined as the passivation−free area between

devices.

Figure 2. Die Dimensions

MECHANICAL PACKAGE DIAGRAM

Figure 3. Die−Array on Wafer

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