7SB384

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7

PACKAGE DIMENSIONS

UDFN6 1.2x1.0, 0.4P

CASE 517AA−01

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND

0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

B

E

D

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

L

5X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

10X

A

A1

(A3)

0.08 C

0.10 C

C

SEATING

PLANE

SIDE VIEW

L2

1

3

4

6

DIM MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.127 REF

b

0.15

0.25

D

1.20 BSC

E

1.00 BSC

e

0.40 BSC

L

0.30

0.40

L1

0.00

0.15

MOUNTING FOOTPRINT*

DIMENSIONS: MILLIMETERS

0.22

6X

0.42

6X

1.07

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

L1

DETAIL A

Bottom View

(Optional)

A1

A3

DETAIL B

Side View

(Optional)

EDGE OF PACKAGE

MOLD CMPD

EXPOSED Cu

L2

0.40

0.50