HX316LC10FBK2-8 datasheet(1/2 Pages) ETC2

Part #	HX316LC10FBK2-8

Description	DDR3L-1600 CL10 240-Pin DIMM Kit

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DESCRIPTION

HyperX HX316LC10FBK2/8 is kit of two 512M x 64-bit (4GB)

DDR3L-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8, low

voltage, memory modules, based on eight 512M x 8-bit DDR3

FBGA components. Total kit capacity is 8GB. Each module kit

supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0.

This module has been tested to run at DDR3L-1600 at a low

latency timing of 10-10-10 at 1.35V. Additional timing parame-

ters are shown in the PnP Timing Parameters section below.

The JEDEC standard electrical and mechanical specifications

areas follows:

Document No. 4807380-001.A00

08/24/15

Page 1

SPECIFICATIONS

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c

0

1

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L

C

Row Cycle Time (tRCmin)

48.125ns (min.)

Refresh to Active/Refresh

260ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin)

37.5ns (min.)

Maximum Operating Power

TBD W*

0

-

V

4

9

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Operating Temperature

0o C to 85o C

Storage Temperature

-55o C to +100o C

*Power will vary depending on the SDRAM used.

FEATURES

• JEDEC standard 1.35V and 1.5V Power Supply

• VDDQ = 1.35V and 1.5V

• 800MHz fCK for 1600Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 11, 10, 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE ≤ 95°C

• Asynchronous Reset

• Height 1.291” (32.80mm) w/heatsink, single sided

component

HX316LC10FBK2/8

8GB (4GB 512M x 64-Bit x 2 pcs.)

DDR3L-1600 CL10 240-Pin DIMM Kit

Continued >>

hyperxgaming.com

PnP JEDEC TIMING PARAMETERS:

Note:

The PnP feature offers a range of speed and timing options to support

the widest variety of processors and chipsets. Your maximum speed will

be determined by your BIOS.

• JEDEC/PnP:

DDR3L-1600 CL10-10-10 @1.35V/1.5V

DDR3L-1333 CL9-9-9 @1.35V/1.5V

DDR3L-1066 CL7-7-7 @1.35V/1.5V

• XMP Profile #1:

DDR3L-1600 CL10-10-10 @1.35V

HX316LC10FBK2/8

8GB (4GB 512M x 64-Bit x 2 pcs.)

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