CMOS linear image sensor

S12443

9

Time

300 °C

Preheating

60 to 120 s

Soldering

60 to 150 s

Peak temperature

260 °C max.

217 °C

200 °C

150 °C

Peak temperature - 5 °C

30 s max.

25 °C to peak temperature

8 m max.

Heating

3 °C/s max.

Cooling

6 °C/s max.

KMPDB0405EA

Recommended temperature profile for reflow soldering (typical example)

∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a

humidity of 60% or less, and perform soldering within 4 weeks.

∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used.

Before actual reflow soldering, check for any problems by tesitng out the reflow soldering methods in advance.

Precautions

(1) Electrostatic countermeasures

· This device has a built-in protection circuit as a safeguard against static electrical charges. However, to prevent destroying the device

with electrostatic charges, take countermeasures such as grounding yourself, the workbench and tools.

· Protect this device from surge voltages which might be caused by peripheral equipment.

(2) Package handling

· The photosensitive area of this device is sealed and protected by transparent resin. When compared to a glass faceplate, the surface

of transparent resin may be less uniform and is more likely to be scratched. Be very careful when handling this device and also when

designing the optical systems.

· Dust or grime on the light input window might cause nonuniform sensitivity. To remove dust or grime, blow it off with compressed air.

(3) Surface protective tape

· Protective tape is affixed to the surface of this product to protect the photosensitive area. After assembling the product, remove the

tape before use.