TPS61259 datasheet(4/33 Pages) TI

Part #	TPS61259

Description	TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging

Download	33 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

Logo

4 / 33 page

TPS61253, TPS61254, TPS61256, TPS61258, TPS61259

SLVSAG8E – SEPTEMBER 2011 – REVISED MARCH 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

Voltage at VIN(2), VOUT(2), SW(2), EN(2), BP(2)

–0.3

7

V

Continuous average current into SW (3)

1.8

Input current

A

Peak current into SW (4)

3.5

Power dissipation

Internally limited

Operating, TA

(5)

–40

85

Temperature

Operating virtual junction, TJ

–40

150

°C

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

(3)

Limit the junction temperature to 105°C for continuous operation at maximum output power.

(4)

Limit the junction temperature to 125°C for 5% duty cycle operation.

(5)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105°C.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

V(ESD)

Electrostatic discharge

V

C101(2)

Machine model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

TPS61253

2.65(1)

4.85

TPS61254

2.5

4.35

TPS61256

2.5

4.85

VI

Input voltage range

V

TPS61257

2.5

4.15

TPS61258

2.65(1)

4.35

TPS61259

2.65(1)

4.85

RL

Minimum resistive load for start-up

TPS6125x

55

Ω

L

Inductance

0.7

1.0

2.9

µH

CO

Output capacitance

3.5

5

50

µF

TA

Ambient temperature

–40

85

°C

TJ

Operating junction temperature

–40

125

°C

(1)

Up to 1000mA peak output current.

4

Submit Documentation Feedback

Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259

Similar Part No. - TPS61259

Manufacturer	Part #	Datasheet	Description
Texas Instruments	TPS61259	5Mb / 34P	[Old version datasheet] 3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING
	TPS612592	6Mb / 37P	[Old version datasheet] TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging
	TPS612592A	2Mb / 34P	[Old version datasheet] TPS61253A 3.8-MHz, 5-V / 4-A Boost Converter in 1.2-mm x 1.3-mm WCSP
	TPS612592A	1Mb / 35P	[Old version datasheet] TPS61253A, TPS61253E 3.8-MHz, 5-V, 4-A Boost Converter in 1.2-mm x 1.3-mm WCSP REVISED JUNE 2023
	TPS612592YFFR	6Mb / 37P	[Old version datasheet] TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging

More results

Similar Description - TPS61259

Manufacturer	Part #	Datasheet	Description
Texas Instruments	TPS61253_016	6Mb / 37P	[Old version datasheet] TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging
	TPS61253	5Mb / 34P	[Old version datasheet] 3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING
	TPS61256C	2Mb / 29P	[Old version datasheet] 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging
	TPS61253	6Mb / 35P	[Old version datasheet] High Efficiency Step-Up Converter In Chip Scale Packaging
	TPS61256A	3Mb / 32P	[Old version datasheet] 3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER FEATURING 2.3A CURRENT LIMIT IN CHIP SCALE PACKAGING
	TPS61240-Q1	633Kb / 24P	[Old version datasheet] 3.5-MHz High Efficiency Step-Up Converter
	TPS61240-Q1	534Kb / 25P	[Old version datasheet] 3.5-MHz High Efficiency Step-Up Converter
	TPS61240	934Kb / 25P	[Old version datasheet] 3.5-MHz High Efficiency Step-Up Converter
	TPS62620	1Mb / 28P	[Old version datasheet] 600-mA, 6-MHz High-Efficiency Step-Down Converter In Chip Scale Packaging
	TPS61240-Q1	1Mb / 26P	[Old version datasheet] 3.5-MHz High Efficiency Step-Up Converter

More results

TPS61259 Datasheet(PDF) 4 Page - Texas Instruments

TPS61259 Datasheet(HTML) 4 Page - Texas Instruments

Similar Part No. - TPS61259

Similar Description - TPS61259

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

Datasheet Download

Link URL