TPS61252

SLVSAG3A – SEPTEMBER 2010 – REVISED DECEMBER 2014

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, VOUT, SW, EN, PG, FB, ILIM

–0.3

7

V

–40

150

Temperature

°C

–65

150

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

8.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage at VIN

2.3

6.0

V

Output voltage at VOUT

3.0

6.5

V

100

1500

mA

–40

85

°C

–40

125

°C

8.4 Thermal Information

TPS61252

DSG

UNIT

8 PINS

Junction-to-ambient thermal resistance

80.2

Junction-to-case (top) thermal resistance

93.5

Junction-to-board thermal resistance

54.2

°C/W

Junction-to-top characterization parameter

0.9

Junction-to-board characterization parameter

59.3

Junction-to-case (bottom) thermal resistance

20

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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