1

InGaAs PIN photodiode

G11777-003P

Surface mounted type COB (chip on board) package

www.hamamatsu.com

Structure

Absolute maximum ratings

Electrical and optical characteristics (Ta=25 °C)

Parameter

Symbol

Specification

Unit

Window material

-

Resin

-

Package

-

Surface mount type COB

-

Photosensitive area

-

φ0.3

mm

Parameter

Symbol

Value

Unit

Reverse voltage

10

V

Operating temperature

Topr

-25 to +80

°C

Storage temperature

Tstg

-40 to +85

°C

Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the

product within the absolute maximum ratings.

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Spectral response range

λ

-

0.9 to 1.7

-

μm

Peak sensitivity wavelength

λp

-

1.55

-

μm

Photosensitivity

S

λ=1.3 μm

0.70

0.85

-

A/W

λ=λp

0.75

0.95

-

Dark current

-

0.1

0.8

nA

Cutoff frequency

fc

300

500

-

MHz

Terminal capacitance

Ct

-

6

10

pF

Shunt resistance

Rsh

100

700

-

MΩ

Detectivity

D*

λ=λp

-

Noise equivalent power

NEP

λ=λp

-

The G11777-003P may be damaged by electrostatic discharge. Be carefull when using the G11777-003P.

The G11777-003P is a small-size near infrared detector available in a surface mount COB (chip on board) package.

Its size is drastically reduced compared to the previous metal package type (G8376-03). The spectral response covers a

range from 0.9 to 1.7 μm (with peak sensitivity wavelength at 1.55 μm) and delivers high sensitivity and low noise. In

addition to optical communication, other applications include analysis and measurement utilizing near infrared light.

High sensitivity

High-speed response

Photosensitive area: φ0.3 mm

Surface mount type

Small size COB package

Low cost

Compatible lead-free reflow soldering

Low noise

Measurement

Analysis

Optical light level monitor

Features

Applications