TPS54339E

SLVSBM0A – DECEMBER 2012 – REVISED DECEMBER 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

TRANSPORT

ORDERABLE PART NUMBER

PIN

MEDIA

TPS54339EDDA

Tube

–40°C to 85°C

DDA

8

TPS54339EDDAR

Tape and Reel

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

All package options have Cu NIPDAU lead/ball finish.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

VIN, EN

–0.3

25

VBST

–0.3

31

VBST (10 ns transient)

–0.3

33

Input voltage range

VBST (vs SW)

–0.3

6.5

V

VFB, SS

–0.3

6.5

SW

–2

25

SW (10 ns transient)

–3

27

VREG5

–0.3

6.5

Output voltage range

V

GND

–0.3

0.3

–0.2

0.2

V

Human Body Model (HBM)

2

kV

Electrostatic discharge

Charged Device Model (CDM)

500

V

–40

150

°C

–55

150

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS54339E

UNITS

DDA (8 PINS)

Junction-to-ambient thermal resistance

46.2

Junction-to-case (top) thermal resistance

53.9

Junction-to-board thermal resistance

29.7

°C/W

Junction-to-top characterization parameter

10.0

Junction-to-board characterization parameter

29.6

Junction-to-case (bottom) thermal resistance

6.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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