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TPS40200HD Datasheet(PDF) 6 Page - Texas Instruments |
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TPS40200HD Datasheet(HTML) 6 Page - Texas Instruments |
6 / 48 page 1 10 100 1000 10000 100000 1000000 110 130 150 170 190 210 230 Continous TJ (°C) Electromigration Fail Mode TPS40200-HT SGLS400C – OCTOBER 2009 – REVISED DECEMBER 2012 www.ti.com THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PACKAGE PARAMETER MIN TYP MAX UNIT D θJC Junction-to-case thermal resistance 49 °C/W Junction-to-case thermal resistance (to bottom of case) 5.7 HKJ or HKQ θJC °C/W Junction-to-case thermal resistance (to top of case lid - as if formed dead bug) 13.7 Figure 3. TPS40200SKGD1 Operating Life Derating Chart Notes: 1. See datasheet for absolute maximum and minimum recommended operating conditions. 2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). 6 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Product Folder Links: TPS40200-HT |
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