TLV62130, TLV62130A

SLVSB74D – FEBRUARY 2012 – REVISED AUGUST 2015

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8 Specifications

8.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVIN, PVIN

–0.3

20

V

EN, SS/TR

–0.3

SW

–0.3

V

DEF, FSW, FB, PG, VOS

–0.3

7

V

Power Good sink current

PG

10

mA

Operating junction temperature

–40

125

°C

Storage temperature

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

V

Charged device model (CDM), per JEDEC specification

±500

(1)

ESD testing is performed according to the respective JESD22 JEDEC standard.

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIX

MAX

UNIT

Supply Voltage

3

17

V

–40

85

°C

–40

125

8.4 Thermal Information

TLV62130

RGT [VQFN]

UNIT

16 PINS

Junction-to-ambient thermal resistance

29.1

°C/W

Junction-to-case (top) thermal resistance

15

°C/W

Junction-to-board thermal resistance

11

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

10

°C/W

Junction-to-case (bottom) thermal resistance

3.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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