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TLV62130 Datasheet(PDF) 4 Page - Texas Instruments |
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TLV62130 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 38 page TLV62130, TLV62130A SLVSB74D – FEBRUARY 2012 – REVISED AUGUST 2015 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Pin voltage (1) AVIN, PVIN –0.3 20 V EN, SS/TR –0.3 VIN+0.3 SW –0.3 VIN+0.3 V DEF, FSW, FB, PG, VOS –0.3 7 V Power Good sink current PG 10 mA Operating junction temperature TJ –40 125 °C Storage temperature Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all ±2000 pins(2) VESD Electrostatic discharge(1) V Charged device model (CDM), per JEDEC specification ±500 JESD22-C101, all pins(3) (1) ESD testing is performed according to the respective JESD22 JEDEC standard. (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions MIX MAX UNIT Supply Voltage 3 17 V Operating free air temperature, TA –40 85 °C Operating junction temperature, TJ –40 125 8.4 Thermal Information TLV62130 THERMAL METRIC(1) RGT [VQFN] UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 29.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15 °C/W RθJB Junction-to-board thermal resistance 11 °C/W ψJT Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 10 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV62130 TLV62130A |
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