LM22676, LM22676-Q1

SNVS587L – SEPTEMBER 2008 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN to GND

43

V

EN Pin Voltage

–0.5

6

V

–5

V

BOOT Pin Voltage

V

FB Pin Voltage

–0.5

7

V

Power Dissipation

Internally Limited

Junction Temperature

150

°C

For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549).

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a

pulse of up to 50 ns.

6.2 Handling Ratings: LM22676

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

Electrostatic discharge

–2

2

kV

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Handling Ratings: LM22676-Q1

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Electrostatic discharge

–2

2

kV

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN

MAX

UNIT

Supply Voltage

4.5

42

V

Junction Temperature

–40

125

°C

6.5 Thermal Information

LM22676, LM22676-Q1

DDA

NDR

UNIT

8 PINS

7 PINS

Junction-to-ambient thermal resistance

60

22

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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