LM2830, LM2830-Q1

SNVS454E – AUGUST 2006 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN

–0.5

7

V

FB Voltage

–0.5

3

V

EN Voltage

–0.5

7

V

SW Voltage

–0.5

7

V

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.

6.2 ESD Ratings: LM2830

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM2830-Q1

VALUE

UNIT

±2000

WSON corner pins (1, 3, 4, and 6)

±1000

Electrostatic discharge

V

Charged device model (CDM), per

SOT-23 corner pins (1, 3, 4, and 5)

±1000

AEC Q100-011

Other pins

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN

NOM

MAX UNIT

VIN

3

5.5

V

Junction Temperature

–40

125

°C

6.5 Thermal Information

LM2830,

LM2830

LM2830-Q1

UNIT

DBV

NGG

5 PINS

6 PINS

Junction-to-ambient thermal resistance

165.2

53.9

Junction-to-case (top) thermal resistance

69.9

51.2

Junction-to-board thermal resistance

27.3

28.2

°C/W

Junction-to-top characterization parameter

1.8

0.6

Junction-to-board characterization parameter

26.8

28.3

Junction-to-case (bottom) thermal resistance

N/A

8.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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