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Material Content Data Sheet

Sales Product Name

BTS247Z E3062A

Issued

13. February 2015

MA#

MA000926350

Package

PG-TO263-5-2

Weight*

1516.98 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

10.237

0.67

0.67

6748

6748

leadframe

non noble metal

iron

7439-89-6

0.790

0.05

520

inorganic material

phosphorus

7723-14-0

0.237

0.02

156

non noble metal

copper

7440-50-8

788.527

51.98

52.05

519801

520477

wire

non noble metal

aluminium

7429-90-5

1.617

0.11

0.11

1066

1066

encapsulation

organic material

carbon black

1333-86-4

8.786

0.58

5791

plastics

epoxy resin

-

96.641

6.37

63706

inorganic material

silicondioxide

60676-86-0

480.277

31.66

38.61

316602

386099

leadfinish

non noble metal

tin

7440-31-5

10.339

0.68

0.68

6816

6816

plating

inorganic material

phosphorus

7723-14-0

0.008

0.00

5

non noble metal

nickel

7440-02-0

3.422

0.23

0.23

2256

2261

solder

noble metal

silver

7440-22-4

0.200

0.01

132

non noble metal

tin

7440-31-5

0.160

0.01

106

non noble metal

lead

7439-92-1

7.654

0.50

0.52

5046

5284

heatspreader

non noble metal

iron

7439-89-6

0.108

0.01

71

inorganic material

phosphorus

7723-14-0

0.032

0.00

21

non noble metal

copper

7440-50-8

107.943

7.12

7.13

71157

71249

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com