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NXQ1TXA5_SDS Datasheet(PDF) 7 Page - NXP Semiconductors |
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NXQ1TXA5_SDS Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 15 page NXQ1TXA5_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product short data sheet Rev. 1.2 — 10 September 2015 7 of 15 NXP Semiconductors NXQ1TXA5 One-chip 5 V Qi wireless transmitter 8.2.4 Negative Temperature Coefficient (NTC) The NTC input is used to monitor the voltage level on an external NTC resistor network. The NXQ1TXA5 stops delivering power if the input level on the NTC input pin drops below 0.8 V and starts charging again when the level rises above 1.1 V again. The NXQ1TXA5 automatically compensates for variations in the 5 V supply. If the NXQ1TXA5 detects a voltage level below 150 mV on the NTC input pin when charging starts, the temperature sensing function via the NTC is disabled completely. A standard NTC input resistor network does not reach levels below 150 mV for normal operation. So, disabling the NTC temperature protection function can be done by connecting the NTC input pin to ground. The NTC input pin can also be connected to VDDP. As the sensing function then remains active and the input voltage level never drops below 0.8 V, the NXQ1TXA5 power delivery is not stopped. Disabling the NTC temperature sensing by connecting the NTC pin to ground is easier for a PCB layout. The NTC input pin must always be connected to either the VDDP pin, ground, or the NTC network. It must never be left floating. 9. Limiting values 10. Thermal characteristics Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDDP power supply voltage on pin VDDP1 and VDDP2 0.3 +6.0 V Tj junction temperature - 150 C Tstg storage temperature 55 +150 C Tamb ambient temperature 20 +85 C VESD electrostatic discharge voltage Human Body Model (HBM) 2+2 kV Charge Device Model (CDM) 500 +500 V Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient 2-layer application board positioned horizontally in free air; dimensions 45 mm 45 mm 0.8 mm; natural convection; copper coverage on each layer > 95 %; copper thickness each layer 70 m 30 K/W |
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