IN

EN

CP

GND(CP)

OUT

SET

FB

GND

OUT

OUT(FB)

IN

IN(CP)

Exposed Pad

on Bottom

(DAP)

1

2

3

4

5

6

7

8

9

10

11

12

LP38798

www.ti.com

SNOSCT6B – MARCH 2013 – REVISED DECEMBER 2014

5 Pin Configuration and Functions

WSON (DNT) Package

12 Pins

Top View

Connect WSON DAP to GND at Pins 6 and 7.

Pin Functions

PIN

I/O

DESCRIPTION

NUMBER

NAME

1, 2

IN

I

Device unregulated input voltage pins. Connect pins together at the package.

3

IN(CP)

I

Charge pump input voltage pin. Connect directly to pins 1 and 2 at the package.

Charge pump output. See Charge Pump section in Application and Implementation for more

4

CP

O

information.

Enable pin. This pin has an internal pull-up to turn the LDO output On by default. A logic low

5

EN

I

level will turn the LDO output Off, and reduce the operating current of the device. See Enable

Input Operation section in Application and Implementation for more information.

6

GND(CP)

—

Device charge pump ground pin.

7

GND

—

Device analog ground pin.

8

FB

i

Feedback pin for programming the output voltage.

Reference voltage output, and noise filter input. A feedback resistor divider network from this

9

SET

I/O

pin to FB and GND will set the output voltage of the device.

10

OUT(FB)

I

OUT buffer feedback input pin. Connect directly to pins 11 and 12 at the package.

11, 12

OUT

O

Device regulated output voltage pins. Connect pins together at the package.

The exposed die attach pad on the bottom of the package should be connected to a copper

thermal pad on the PCB at ground potential. Connect to ground potential or leave floating. Do

Exposed Pad

DAP

—

not connect to any potential other than the same ground potential seen at device pins 6

(GND(CP)) and 7 (GND). See Thermal Considerations section in Layout for more information.

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