LM3480

SNVS011H – JUNE 1999 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Input voltage (IN to GND)

–0.3

35

V

Internally

Limited

–40

150

°C

−65

150

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.

For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.

(2)

If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

power can be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures.

The Absolute Maximum power dissipation can be increased by 3.7 mW for each °C below 50°C ambient. It must be derated by 3.7 mW

for each °C above 50°C ambient. Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction

temperature to about 150°C.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Maximum input voltage (IN to GND)

0

30

V

–40

125

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.

For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.

6.4 Thermal Information

LM3480

SOT-23 (DBZ)

UNIT

3 PINS

Junction-to-ambient thermal resistance

269.6

Junction-to-case (top) thermal resistance

141.1

Junction-to-board thermal resistance

63.1

°C/W

Junction-to-top characterization parameter

24.2

Junction-to-board characterization parameter

62.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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