25LC320

DS21158B-page 2

Preliminary

© 1996 Microchip Technology Inc.

1.0

ELECTRICAL

CHARACTERISTICS

1.1

Storage temperature ............................ -65

°C to 150°C

Ambient temperature under bias .......... -65

°C to 125°C

Soldering temperature of leads

(10 seconds) .................................................... +300

°C

ESD protection on all pins..................................... 4 kV

*Notice: Stresses above those listed under ‘Maximum ratings’

may cause permanent damage to the device. This is a stress rat-

ing only and functional operation of the device at those or any

other conditions above those indicated in the operational listings

of this specification is not implied. Exposure to maximum rating

conditions for extended period of time may affect device reliability

TABLE 1-1:

PIN FUNCTION TABLE

Name

Function

CS

Chip Select Input

SO

Serial Data Output

SI

Serial Data Input

SCK

Serial Clock Input

WP

Write Protect Pin

Ground

Supply Voltage

HOLD

Hold Input

NC

No Connect

FIGURE 1-1: AC TEST CIRCUIT

1.2

AC Test Conditions

AC Waveform:

(Note 1)

(Note 2)

Timing Measurement Reference Level

Input

Output

≤ 4.0V

Vcc

SO

100 pF

1.8 K

2.25 K

TABLE 1-2:

DC CHARACTERISTICS

Applicable over recommended operating ranges shown below unless otherwise noted:

Commercial (C):

Tamb

= 0

°C to +70°C

Industrial (I):

Tamb

= -40

°C to +85°C

Parameter

Symbol

Min

Max

Units

Test Conditions

High level input voltage

2.0

V

≥ 2.7V

V

Low level input voltage

-0.3

0.8

V

≥ 2.7V

-0.3

Low level output voltage

—

0.4

V

High level output voltage

—

V

µA

Input leakage current

-10

10

Output leakage current

-10

10

Internal Capacitance

(all inputs and outputs)

—

7

pF

Tamb=25

Operating Current

—

—

5

3

mA

mA

—

—

1

500

mA

µA

Standby Current

—5

2

µA

µA

Note:

This parameter is periodically sampled and not 100% tested.