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Material Content Data Sheet

Sales Product Name

2EDL23N06PJ

Issued

1. April 2015

MA#

MA001192604

Package

PG-DSO-14-49

Weight*

139.10 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.871

1.34

1.34

13449

13449

leadframe

inorganic material

phosphorus

7723-14-0

0.014

0.01

103

non noble metal

zinc

7440-66-6

0.057

0.04

413

non noble metal

iron

7439-89-6

1.150

0.83

8264

non noble metal

copper

7440-50-8

46.675

33.56

34.44

335551

344331

wire

noble metal

gold

7440-57-5

0.258

0.19

0.19

1855

1855

encapsulation

organic material

carbon black

1333-86-4

0.173

0.12

1247

plastics

epoxy resin

-

9.368

6.74

67351

inorganic material

silicondioxide

60676-86-0

77.202

55.50

62.36

555018

623616

leadfinish

non noble metal

tin

7440-31-5

1.241

0.89

0.89

8925

8925

plating

noble metal

silver

7440-22-4

0.307

0.22

0.22

2203

2203

glue

plastics

acrylic resin

-

0.172

0.12

1237

noble metal

silver

7440-22-4

0.610

0.44

0.56

4384

5621

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com