2

FN8165.3

August 29, 2006

Ordering Information

PART NUMBER

PART

MARKING

POTENTIOMETER

ORGANIZATION (k

Ω)

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

X9250TS24I

X9250TS I

5 ±10%

100

-40 to +85

24 Ld SOIC (300 mil)

M24.3

X9250TS24IZ (Note)

X9250TS ZI

-40 to +85

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250TV24I

X9250TV I

-40 to +85

24 Ld TSSOP

(4.4mm)

MDP0044

X9250TV24IZ (Note)

X9250TV ZI

-40 to +85

24 Ld TSSOP

(4.4mm) (Pb-free)

MDP0044

X9250US24

X9250US

50

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9250US24Z (Note)

X9250US Z

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250US24I

X9250US I

-40 to +85

24 Ld SOIC (300 mil)

M24.3

X9250US24IZ (Note)

X9250US ZI

-40 to +85

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250UV24I

X9250UV I

-40 to +85

24 Ld TSSOP

(4.4mm)

MDP0044

X9250UV24IZ (Note)

X9250UV ZI

-40 to +85

24 Ld TSSOP

(4.4mm) (Pb-free)

MDP0044

X9250TS24-2.7

X9250TS F

-2.7 to 5.5

100

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9250TS24Z-2.7 (Note)

X9250TS ZF

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250TS24I-2.7*

X9250TS G

-40 to +85

24 Ld SOIC (300 mil)

M24.3

X9250TS24IZ-2.7*

(Note)

X9250TS ZG

-40 to +85

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250TV24I-2.7

X9250TV G

-40 to +85

24 Ld TSSOP

(4.4mm)

MDP0044

X9250TV24IZ-2.7 (Note) X9250TV ZG

-40 to +85

24 Ld TSSOP

(4.4mm) (Pb-free)

MDP0044

X9250US24-2.7*

X9250US F

50

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9250US24Z-2.7* (Note) X9250US ZF

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250US24I-2.7

X9250US G

-40 to +85

24 Ld SOIC (300 mil)

M24.3

X9250US24IZ-2.7 (Note) X9250US ZG

-40 to +85

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9250UV24-2.7

X9250UV F

0 to +70

24 Ld TSSOP

(4.4mm)

MDP0044

X9250UV24Z-2.7 (Note) X9250UV ZF

0 to +70

24 Ld TSSOP

(4.4mm) (Pb-free)

MDP0044

X9250UV24I-2.7

X9250UV G

-40 to +85

24 Ld TSSOP

(4.4mm)

MDP0044

X9250UV24IZ-2.7 (Note) X9250UV ZG

-40 to +85

24 Ld TSSOP

(4.4mm) (Pb-free)

MDP0044

*Add "T1" suffix for tape and reel.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

X9250