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Material Content Data Sheet

Sales Product Name

BSC020N03MS G

Issued

7. May 2015

MA#

MA000457490

Package

PG-TDSON-8-1

Weight*

121.26 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

2.944

2.43

2.43

24279

24279

leadframe

non noble metal

iron

7439-89-6

0.038

0.03

312

inorganic material

phosphorus

7723-14-0

0.011

0.01

94

non noble metal

copper

7440-50-8

37.762

31.15

31.19

311421

311827

wire

non noble metal

copper

7440-50-8

0.039

0.03

0.03

320

320

encapsulation

organic material

carbon black

1333-86-4

0.083

0.07

681

plastics

epoxy resin

-

5.860

4.83

48326

inorganic material

silicondioxide

60676-86-0

35.324

29.13

34.03

291316

340323

leadfinish

non noble metal

tin

7440-31-5

1.452

1.20

1.20

11972

11972

plating

noble metal

silver

7440-22-4

0.166

0.14

0.14

1365

1365

solder

noble metal

silver

7440-22-4

0.066

0.05

543

non noble metal

tin

7440-31-5

0.053

0.04

434

non noble metal

lead

7439-92-1

2.516

2.07

2.16

20747

21724

CLIP plating

noble metal

silver

7440-22-4

1.289

1.06

1.06

10634

10634

heatspreader

non noble metal

iron

7439-89-6

0.011

0.01

93

inorganic material

phosphorus

7723-14-0

0.003

0.00

28

non noble metal

copper

7440-50-8

11.320

9.34

9.35

93357

93478

heat sink CLIP

non noble metal

iron

7439-89-6

0.022

0.02

184

inorganic material

phosphorus

7723-14-0

0.007

0.01

55

non noble metal

copper

7440-50-8

22.292

18.38

18.41

183839

184078

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com