ESD200-B1-CSP0201

Low Clamping Voltage TVS Diode in a Thin 0201 Chip Scale Package

Final Data Sheet

4

Revision 1.0, 2013-05-21

1

Low Clamping Voltage TVS Diode in a Thin 0201 Chip Scale

Package

1.1

Features

1.2

Application Examples

•

ESD Protection of highly susceptible IC/ASICs in audio, headset, human digital interfaces

•

Dedicated solution to boost space saving and high performance in miniaturized modern electronics

1.3

Product Description

Figure 1-1 Pin Configuration and Schematic Diagram

•

ESD / Transient protection of susceptible I/O lines to:

– IEC61000-4-2 (ESD): ±16 kV (air/contact discharge)

– IEC61000-4-5 (surge): ±3 A (8/20

μs))

•

Low clamping voltage

•

•

Supports applications with signal voltage between -5.5 V and 5.5 V max.

•

•

Minimized overshoot due to extremely low parasitic inductance of chip scale package

•

Miniature form factor (XY) = 0201 (0.58 mm x 0.28 mm)

•

Thin 0.15 mm package thickness to allow direct integration into modules

•

Optimized assembly: its bidirectional and symmetric I/V characteristics allow

placement on the PCB with no danger of polarity orientation issues

Table 1-1

Ordering Information

Type

Package

Configuration

Marking code

ESD200-B1-CSP0201

WLL-2-1

1 line, bi-directional

1) The device does not have any marking or date code on the device backside. The Marking code is on pad side.

Configuration_Schematic_Diagram.vst.vsd

b) Schematic diagram

a) Pin configuration top view