KAD5510P

4

FN7693.2

May 2, 2011

Ordering Information

PART NUMBER

(Notes 1, 2)

PART

MARKING

SPEED

(MSPS)

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

KAD5510P-25Q48

KAD5510P-25 Q48EP-I

250

-40 to +85

48 Ld QFN

L48.7x7E

KAD5510P-21Q48

KAD5510P-21 Q48EP-I

210

-40 to +85

48 Ld QFN

L48.7x7E

KAD5510P-17Q48

KAD5510P-17 Q48EP-I

170

-40 to +85

48 Ld QFN

L48.7x7E

KAD5510P-12Q48

KAD5510P-12 Q48EP-I

125

-40 to +85

48 Ld QFN

L48.7x7E

NOTES:

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-

free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

2. For Moisture Sensitivity Level (MSL), please see device information page for KAD5510P. For more information on MSL please see techbrief TB363.