ISLA112P50

3

FN7604.2

August 1, 2011

Pin Configuration

ISLA112P50

(72 LD QFN)

TOP VIEW

Ordering Information

PART NUMBER

(Notes 1, 2)

PART

MARKING

SPEED

(MSPS)

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISLA112P50IRZ

ISLA112P50 IRZ

500

-40 to +85

72 Ld QFN

L72.10x10C

NOTES:

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-

free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

2. For Moisture Sensitivity Level (MSL), please see device information page for ISLA112P50. For more information on MSL please see techbrief TB363.

FIGURE 2. PIN CONFIGURATION

r

nf

ide

nt

ial

Inf

or

ma

tio

n

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

CLKOUTP

CLKOUTN

D8P

D8N

D7P

D7N

D6P

D6N

OVSS

D5P

D5N

D4P

D4N

D3P

D3N

D2P

D2N

RLVDS

AVDD

DNC

DNC

AVDD

AVSS

AVSS

VINN

VINP

AVSS

AVDD

DNC

DNC

VCM

DNC

DNC

RES

RES

CONNECT THERMAL PAD TO AVSS

DNC

PD