PSMN2R9-25YLC

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 2 May 2011

11 of 15

NXP Semiconductors

PSMN2R9-25YLC

N-channel 25 V 3.15 m

Ω logic level MOSFET in LFPAK using

8.

Package outline

Fig 19. Package outline SOT669 (LFPAK; Power-SO8)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT669

MO-235

06-03-16

11-03-25

0

2.5

5 mm

scale

e

E1

b

c2

A2

A2

bc

A

e

UNIT

DIMENSIONS (mm are the original dimensions)

mm

1.10

0.95

A3

A1

0.15

0.00

1.20

1.01

0.50

0.35

b2

4.41

3.62

b3

2.2

2.0

b4

0.9

0.7

0.25

0.19

c2

0.30

0.24

4.10

3.80

6.2

5.8

H

1.3

0.8

L2

0.85

0.40

L

1.3

0.8

L1

8

°

0

°

wy

5.0

4.8

3.3

3.1

E1

(1)

D1

(1)

max

0.25

4.20

1.27

0.25

0.1

1

23

4

mounting

base

D1

c

Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads

SOT669

E

b2

b3

b4

H

D

L2

L1

A

A

C

C

X

1/2

e

yC

θ

θ

(A )

3

L

A

A1

detail X

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.