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MA001073322 Datasheet(PDF) 1 Page - Infineon Technologies AG |
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MA001073322 Datasheet(HTML) 1 Page - Infineon Technologies AG |
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1 / 1 page 1. 2. 3. Material Content Data Sheet Sales Product Name BSC014N04LSI Issued 3. June 2015 MA# MA001073322 Package PG-TDSON-8-17 Weight* 118.55 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] chip inorganic material silicon 7440-21-3 1.009 0.85 0.85 8515 8515 leadframe non noble metal iron 7439-89-6 0.038 0.03 319 inorganic material phosphorus 7723-14-0 0.011 0.01 96 non noble metal copper 7440-50-8 37.762 31.86 31.90 318539 318954 wire noble metal gold 7440-57-5 0.045 0.04 0.04 376 376 encapsulation organic material carbon black 1333-86-4 0.087 0.07 731 plastics epoxy resin - 6.156 5.19 51933 inorganic material silicondioxide 60676-86-0 37.112 31.31 36.57 313058 365722 leadfinish non noble metal tin 7440-31-5 1.470 1.24 1.24 12399 12399 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1396 1396 solder noble metal silver 7440-22-4 0.036 0.03 306 non noble metal tin 7440-31-5 0.029 0.02 245 non noble metal lead 7439-92-1 1.387 1.17 1.22 11699 12250 heatspreader inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal zinc 7440-66-6 0.013 0.01 113 non noble metal iron 7439-89-6 0.269 0.23 2266 non noble metal copper 7440-50-8 10.909 9.20 9.44 92024 94431 heat sink CLIP inorganic material phosphorus 7723-14-0 0.007 0.01 56 non noble metal zinc 7440-66-6 0.026 0.02 223 non noble metal iron 7439-89-6 0.529 0.45 4463 non noble metal copper 7440-50-8 21.482 18.12 18.60 181215 185957 *deviation < 10% Sum in total: 100.00 1000000 Important Remarks: Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com |
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