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Material Content Data Sheet

Sales Product Name

BSC014N04LSI

Issued

3. June 2015

MA#

MA001073322

Package

PG-TDSON-8-17

Weight*

118.55 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.009

0.85

0.85

8515

8515

leadframe

non noble metal

iron

7439-89-6

0.038

0.03

319

inorganic material

phosphorus

7723-14-0

0.011

0.01

96

non noble metal

copper

7440-50-8

37.762

31.86

31.90

318539

318954

wire

noble metal

gold

7440-57-5

0.045

0.04

0.04

376

376

encapsulation

organic material

carbon black

1333-86-4

0.087

0.07

731

plastics

epoxy resin

-

6.156

5.19

51933

inorganic material

silicondioxide

60676-86-0

37.112

31.31

36.57

313058

365722

leadfinish

non noble metal

tin

7440-31-5

1.470

1.24

1.24

12399

12399

plating

noble metal

silver

7440-22-4

0.166

0.14

0.14

1396

1396

solder

noble metal

silver

7440-22-4

0.036

0.03

306

non noble metal

tin

7440-31-5

0.029

0.02

245

non noble metal

lead

7439-92-1

1.387

1.17

1.22

11699

12250

heatspreader

inorganic material

phosphorus

7723-14-0

0.003

0.00

28

non noble metal

zinc

7440-66-6

0.013

0.01

113

non noble metal

iron

7439-89-6

0.269

0.23

2266

non noble metal

copper

7440-50-8

10.909

9.20

9.44

92024

94431

heat sink CLIP

inorganic material

phosphorus

7723-14-0

0.007

0.01

56

non noble metal

zinc

7440-66-6

0.026

0.02

223

non noble metal

iron

7439-89-6

0.529

0.45

4463

non noble metal

copper

7440-50-8

21.482

18.12

18.60

181215

185957

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com