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BUK625R2-30C Datasheet(PDF) 3 Page - NXP Semiconductors

Part # BUK625R2-30C
Description  N-channel TrenchMOS intermediate level FET
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUK625R2-30C Datasheet(HTML) 3 Page - NXP Semiconductors

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BUK625R2-30C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 12 July 2011
3 of 14
NXP Semiconductors
BUK625R2-30C
N-channel TrenchMOS intermediate level FET
4.
Limiting values
[1]
Accumulated pulse duration not to exceed 5 mins.
[2]
-16V accumulated duration not to exceed 168 hrs
[3]
Continuous current is limited by package.
[4]
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[5]
Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[6]
Refer to application note AN10273 for further information.
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
-
30
V
VGS
gate-source voltage
Pulsed
[1]
-20
20
V
DC
[2]
-16
16
V
ID
drain current
Tmb =25 °C; VGS =10V; see Figure 1
[3]
-90
A
Tmb = 100 °C; VGS =10 V; see Figure 1
-81
A
IDM
peak drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
see Figure 3
-
455
A
Ptot
total power dissipation
Tmb =25 °C; see Figure 2
-
128
W
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Source-drain diode
IS
source current
Tmb =25 °C
[3]
-90
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
455
A
Avalanche ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
ID =90A; Vsup ≤ 30 V; RGS =50 Ω;
VGS =10 V; Tj(init) = 25 °C; unclamped
-
153
mJ
EDS(AL)R
repetitive drain-source
avalanche energy
[4][5][6]
--mJ


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