BUK625R2-30C

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 12 July 2011

10 of 14

NXP Semiconductors

BUK625R2-30C

N-channel TrenchMOS intermediate level FET

7.

Package outline

Fig 17. Package outline SOT428 (DPAK)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT428

SC-63

TO-252

SOT428

06-02-14

06-03-16

DIMENSIONS (mm are the original dimensions)

Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)

A

2

13

L

e

mounting

base

wA

M

b

E

c

y

0

5

10 mm

scale

UNIT

mm

0.93

0.46

5.46

5.00

0.56

0.20

6.22

5.98

6.73

6.47

10.4

9.6

2.95

2.55

2.38

2.22

1.1

0.9

0.89

0.71

bc

0.9

0.5

Ee

2.285

4.57

4.0

min

4.45

min

0.5

min

Lw

0.2

y

max

0.2

A