ISL9016

11

FN6832.1

May 16, 2011

Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)

B

D

A

E

0.15 C

2X

PIN 1

TOP VIEW

0.15 C

2X

REFERENCE

DETAIL A

0.10 C

0.08 C

6X

A3

C

SEATING

PLANE

L

e

46

31

BOTTOM VIEW

SIDE VIEW

0.10

CAB

b6X

DETAIL A

0.127 +0.058

A1

A1

A

0.127±0.008

64

13

M

CO.2

1.00 REF

D2

DAP SIZE 1.30 x 0.76

E2

-0.008

TERMINAL THICKNESS

0.30

1.00

0.45

0.50

0.25

1.25

2.00

1.00

LAND PATTERN 6

L6.1.6x1.6A

6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

-

D

1.55

1.60

1.65

4

D2

0.40

0.45

0.50

-

E

1.55

1.60

1.65

4

E2

0.95

1.00

1.05

-

e

0.50 BSC

-

L

0.25

0.30

0.35

-

Rev. 1 6/06

NOTES:

1. Dimensions are in mm. Angles in degrees.

2. Coplanarity applies to the exposed pad as well as the terminals.

Coplanarity shall not exceed 0.08mm.

3. Warpage shall not exceed 0.10mm.

4. Package length/package width are considered as special

characteristics.

5. JEDEC Reference MO-229.

6. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.