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Material Content Data Sheet

Sales Product Name

BSC0904NSI

Issued

28. July 2015

MA#

MA001015226

Package

PG-TDSON-8-6

Weight*

118.04 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

0.285

0.24

0.24

2410

2410

leadframe

non noble metal

iron

7439-89-6

0.038

0.03

320

inorganic material

phosphorus

7723-14-0

0.011

0.01

96

non noble metal

copper

7440-50-8

37.762

31.99

32.03

319898

320314

wire

noble metal

gold

7440-57-5

0.047

0.04

0.04

394

394

encapsulation

organic material

carbon black

1333-86-4

0.088

0.07

748

plastics

epoxy resin

-

6.268

5.31

53097

inorganic material

silicondioxide

60676-86-0

37.783

32.01

37.39

320080

373925

leadfinish

non noble metal

tin

7440-31-5

1.470

1.25

1.25

12451

12451

plating

noble metal

silver

7440-22-4

0.166

0.14

0.14

1402

1402

solder

noble metal

silver

7440-22-4

0.012

0.01

100

non noble metal

tin

7440-31-5

0.009

0.01

80

non noble metal

lead

7439-92-1

0.450

0.38

0.40

3812

3992

heatspreader

non noble metal

iron

7439-89-6

0.011

0.01

96

inorganic material

phosphorus

7723-14-0

0.003

0.00

29

non noble metal

copper

7440-50-8

11.320

9.59

9.60

95898

96023

heat sink CLIP

non noble metal

iron

7439-89-6

0.022

0.02

189

inorganic material

phosphorus

7723-14-0

0.007

0.01

57

non noble metal

copper

7440-50-8

22.292

18.88

18.91

188843

189089

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com