DRV8812

www.ti.com

SLVS997F – OCTOBER 2009 – REVISED AUGUST 2013

DUAL-BRIDGE MOTOR CONTROLLER IC

Check for Samples: DRV8812

1

FEATURES

APPLICATIONS

2

•

Dual-H-Bridge Current-Control Motor Driver

•

Automatic Teller Machines

–

Capable of Driving a Bipolar Stepper or

•

Money Handling Machines

Two DC Motors

•

Video Security Cameras

–

Two-Bit Winding Current Control Allows Up

•

Printers

to Four Current Levels

•

Scanners

–

Low MOSFET On-Resistance

•

Office Automation Machines

•

1.6-A Maximum Drive Current at 24 V, 25°C

•

Gaming Machines

•

Built-In 3.3-V Reference Output

•

Factory Automation

•

Industry-Standard Parallel Digital Control

•

Robotics

Interface

•

8-V to 45-V Operating Supply Voltage Range

•

Thermally Enhanced HTSSOP and QFN

Surface Mount Packages

DESCRIPTION

The DRV8812 provides an integrated motor driver solution for printers, scanners, and other automated

equipment applications. The device has two H-bridge drivers, and can drive a bipolar stepper motor or two DC

motors. The output driver block for each consists of N-channel power MOSFET’s configured as full H-bridges to

drive the motor windings. The DRV8812 is capable of driving up to 1.6-A of output current (with proper

heatsinking, at 24 V and 25°C).

A simple parallel digital control interface is compatible with industry-standard devices. Decay mode is

programmable.

Internal shutdown functions are provided for over current protection, short circuit protection, under voltage

lockout and overtemperature.

The DRV8812 is available in a 28-pin HTSSOP package with PowerPAD™ and in a 28-pin QFN package

PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).

ORDERABLE PART

TOP-SIDE

NUMBER

MARKING

PowerPAD™ (HTSSOP) - PWP

Reel of 2000

DRV8812PWPR

–40°C to 85°C

DRV8812

PowerPAD™ (QFN) - RHD

Reel of 3000

DRV8812RHDR

(1)

For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2009–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.