SA636

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 6 — 5 December 2012

5 of 31

NXP Semiconductors

SA636

Low voltage high performance mixer FM IF system

6.2 Pin description

[1]

For the HVQFN20 package, the exposed die attach paddle must be connected to device ground pin 13 and

the PCB ground plane. GND pin must be connected to supply ground for proper device operation. For

enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the

board using a corresponding thermal pad on the board and for proper heat conduction through the board,

thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.

Table 2.

Pin description

Symbol

Pin

Description

SSOP20

HVQFN20

RF_IN

1

19

RF input

RF_IN_DECOUPL

2

20

RF input decoupling pin

OSC_OUT

3

1

oscillator output (emitter)

OSC_IN

4

2

oscillator input (base)

5

3

positive supply voltage

RSSI_FEEDBACK

6

4

RSSI amplifier negative feedback terminal

RSSI_OUT

7

5

RSSI output

POWER_DOWN_CTRL

8

6

power-down control; active HIGH

DATA_OUT

9

7

data output

QUADRATURE_IN

10

8

quadrature detector input terminal

LIMITER_OUT

11

9

limiter amplifier output

LIMITER_DECOUPL

12

10

limiter amplifier decoupling pin

LIMITER_DECOUPL

13

11

limiter amplifier decoupling pin

LIMITER_IN

14

12

limiter amplifier input

GND

15

13[1]

ground; negative supply

IF_AMP_OUT

16

14

IF amplifier output

IF_AMP_DECOUPL

17

15

IF amplifier decoupling pin

IF_AMP_IN

18

16

IF amplifier input

IF_AMP_DECOUPL

19

17

IF amplifier decoupling pin

MIXER_OUT

20

18

mixer output

-

-

DAP

exposed die attach paddle; connect to ground