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PSMN075-100MSE Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PSMN075-100MSE
Description  N-channel 100 V 71 m廓 standard level MOSFET in LFPAK33 designed specifically for PoE applications
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PSMN075-100MSE Datasheet(HTML) 3 Page - NXP Semiconductors

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NXP Semiconductors
PSMN075-100MSE
N-channel 100 V 71 mΩ standard level MOSFET in LFPAK33 designed
specifically for PoE applications
PSMN075-100MSE
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved
Product data sheet
26 March 2013
3 / 13
Symbol
Parameter
Conditions
Min
Max
Unit
VGS
gate-source voltage
-20
20
V
VGS = 10 V; Tj = 25 °C; Fig. 1
-
18
A
ID
drain current
VGS = 10 V; Tmb = 100 °C; Fig. 1
-
13
A
IDM
peak drain current
pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 4
-
74
A
Ptot
total power dissipation
Tmb = 25 °C; Fig. 2
-
65
W
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Tsld(M)
peak soldering temperature
-
260
°C
Source-drain diode
IS
source current
Tmb = 25 °C
-
54
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
74
A
Avalanche Ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
VGS = 10 V; Tj(init) = 25 °C; ID = 18 A;
Vsup ≤ 100 V; RGS = 50 Ω; unclamped;
Fig. 3
-
25
mJ
003aak714
0
25
50
75
100 125 150 175 200
0
4
8
12
16
20
Tj (°C)
ID
ID
(A)
(A)
Fig. 1. Continuous drain current as a function of
mounting base temperature
Tmb (°C)
0
200
150
50
100
03aa16
40
80
120
Pder
(%)
0
Fig. 2. Normalized total power dissipation as a
function of mounting base temperature


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