NXP Semiconductors

PMV75UP

20 V, P-channel Trench MOSFET

PMV75UP

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Product data sheet

25 April 2014

11 / 15

13. Soldering

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

Fig. 19. Reflow soldering footprint for TO-236AB (SOT23)

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

Fig. 20. Wave soldering footprint for TO-236AB (SOT23)