NXP Semiconductors

PMV37EN2

30 V, N-channel Trench MOSFET

PMV37EN2

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Product data sheet

3 June 2014

10 / 15

12. Package outline

UNIT

max.

c

D

E

Q

w

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

04-11-04

06-03-16

IEC

JEDEC

JEITA

mm

0.1

0.48

0.38

0.15

0.09

3.0

2.8

1.4

1.2

0.95

e

1.9

2.5

2.1

0.55

0.45

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23

TO-236AB

bp

D

e1

e

A

A1

Lp

Q

detail X

HE

E

B

A

B

0

1

2 mm

scale

A

1.1

0.9

c

X

1

2

3

Plastic surface-mounted package; 3 leads

SOT23

Fig. 18. Package outline TO-236AB (SOT23)