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DAC5675-EP Datasheet(PDF) 2 Page - Texas Instruments |
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DAC5675-EP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 28 page www.ti.com DAC5675-EP SGLS381A – OCTOBER 2006 – REVISED OCTOBER 2006 The DAC5675 has been specifically designed for a differential transformer-coupled output with a 50- Ω doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm) is supported. The last configuration is preferred for optimum performance at high output frequencies and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from AVDD – 1 to AVDD + 0.3 V. An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier allows the user to adjust this output current from 20 mA down to 2 mA. This provides 20-dB gain range control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675 features a SLEEP mode, which reduces the standby power to approximately 18 mW. The DAC5675 is available in a 48-pin PowerPAD™ thermally-enhanced thin quad flat pack (HTQFP). This package increases thermal efficiency in a standard size IC package. The device is specified for operation over the military temperature range of –55 °C to 125°C. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PACKAGE PACKAGE PACKAGE ORDERING TRANSPORT PRODUCT LEAD DESIGNATOR MARKING NUMBER MEDIA, QUANTITY DAC5675MPHPREP Tape and reel, 1000 DAC5675-EP 48 HTQFP PHP DAC5675-EP DAC5675MPHPEP Tray, 250 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. TQFP-48 PACKAGE THERMAL CHARACTERISTICS SAME PACKAGE PowerPAD PARAMETER FORM WITHOUT CONNECTED TO PowerPAD PCB THERMAL PLANE(1) RθJA Thermal resistance, junction to ambient(1)(2) 108.71 °C/W 29.11 °C/W RθJC Thermal resistance, junction to case(1)(2) 18.18 °C/W 1.14 °C/W (1) Airflow is at 0 LFM (no airflow). (2) Specified with the PowerPAD bond pad on the backside of the package soldered to a 2-oz CU plate PCB thermal plane 2 Submit Documentation Feedback |
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