NXP Semiconductors

PSMN3R0-30YLD

N-channel 30 V, 3.0 mΩ logic level MOSFET in LFPAK56 using

NextPowerS3 Technology

PSMN3R0-30YLD

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Product data sheet

18 February 2014

10 / 13

11. Package outline

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT669

MO-235

sot669_po

11-03-25

13-02-27

mm

max

nom

min

1.20

1.01

0.15

0.00

0.25

0.50

0.35

4.41

3.62

2.2

2.0

6.2

5.8

0.85

0.40

A

Dimensions (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads

SOT669

1.10

0.95

b

0.1

w

y

θ

c

3.3

3.1

e

1.27

H

L

0.25

0.19

0.30

0.24

4.20

1.3

0.8

0.25

0.9

0.7

4.10

3.80

5.0

4.8

1.3

0.8

A

C

1/2 e

w

A

0

5 mm

scale

e

b

1

2

3

4

mounting

base

c

E

H

D

C

X

y C

q

L

A

detail X

Fig. 17. Package outline LFPAK56; Power-SO8 (SOT669)