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CHA3667A Datasheet(PDF) 7 Page - United Monolithic Semiconductors |
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CHA3667A Datasheet(HTML) 7 Page - United Monolithic Semiconductors |
7 / 8 page 7-20GHz Amplifier CHA3667a Ref. : DSCHA3667a0158 - 07 Jun 10 7/8 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Bonding pad position Chip Assembly and Mechanical Data Note: 25µm diameter gold wire is to be prefered. DC Pad size: 86 / 83µm RF Pad size: 105/171µm RF wire bondings should be as short as possible, lower than 0.35mm. Chip thickness: 100µm ±.10µm 10nF 120pF DC drain supply feed 10nF 120pF 10nF 120pF 10nF 120pF |
Similar Part No. - CHA3667A_15 |
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Similar Description - CHA3667A_15 |
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