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STR8042 Datasheet(PDF) 4 Page - Solid State Optronic |
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STR8042 Datasheet(HTML) 4 Page - Solid State Optronic |
4 / 8 page STR8042 Random Phase 400V / 0.8A AC Solid State Relay Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s STR8042 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1 © 2014 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 4 of 8 STR8042 H/S/TR Rev 2.10 (09/26/2014) 002165 |
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