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MAX882 Datasheet(PDF) 9 Page - Maxim Integrated Products |
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MAX882 Datasheet(HTML) 9 Page - Maxim Integrated Products |
9 / 16 page 5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators _______________________________________________________________________________________ 9 Foldback Current Limiting The MAX882/MAX883/MAX884 also include a foldback current limiter. It monitors and controls the pass transis- tor’s gate voltage, estimating the output current and limiting it to 430mA for output voltages above 0.8V and (VIN - VOUT) > 0.7V. If the output voltage drops below 0.8V, implying a short-circuit condition, the output cur- rent is limited to 170mA. The output can be shorted to ground for 1 minute without damaging the device if the package can dissipate (VIN x 170mA) without exceed- ing TJ = +150°C. When the output is greater than 0.8V and (VIN - VOUT) < 0.7V (dropout operation), no current limiting is allowed, to provide maximum load drive. Thermal Overload Protection Thermal overload protection limits total power dissipa- tion in the MAX882/MAX883/MAX884. When the junc- tion temperature exceeds TJ =+160°C, the thermal sensor sends a signal to the shutdown logic, turning off the pass transistor and allowing the IC to cool. The thermal sensor turns the pass transistor on again after the IC’s junction temperature cools by 10°C, resulting in a pulsed output during thermal overload conditions. Thermal overload protection is designed to protect the MAX882/MAX883/MAX884 if fault conditions occur. It is not intended to be used as an operating mode. Prolonged operation in thermal shutdown mode may reduce the IC’s reliability. For continual operation, do not exceed the absolute maximum junction temperature rating of TJ = +150°C. Power Dissipation and Operating Region Maximum power dissipation of the MAX882/MAX883/ MAX884 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of air flow. The power dissipation across the device is P = IOUT (VIN - VOUT). The resulting power dissipation is as follows: where (TJ - TA) is the temperature difference between the MAX882/MAX883/MAX884 die junction and the sur- rounding air, θJB (or θJC) is the thermal resistance of the package chosen, and θBA is the thermal resistance through the printed circuit board, copper traces, and other materials to the surrounding air. The 8-pin small-outline package for the MAX882/ MAX883/MAX884 features a special lead frame with a lower thermal resistance and higher allowable power dissipation. This package’s thermal resistance package is θJB = 53°C/W, compared with θJB = 110°C/W for an 8-pin plastic DIP package and θJB = 125°C/W for an 8- pin ceramic DIP package. P (T T ) () JA JB BA = − + θθ Figure 2. Adjustable Output Using External Feedback Resistors Figure 3. Setting an Undervoltage Lockout Threshold Using STBY MAX882 MAX883 MAX884 CIN O.1 µF COUT 2.2 µF OUTPUT VOLTAGE INPUT VOLTAGE LBI OFF (STBY) ( ) ARE FOR MAX882 IN R1 R2 R1 + R2 R2 VOUT = VSET , VSET = 1.20V LOAD OUT GND SET MAX882 CIN O.1 µF COUT 2.2 µF OUTPUT VOLTAGE INPUT VOLTAGE LBI SET STBY IN R1 R2 R1+ R2 R2 VSTBY TRIP = VSTBY , VSTBY = 1.20V OUT GND |
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