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BUK7C06-40AITE Datasheet(PDF) 3 Page - NXP Semiconductors

Part # BUK7C06-40AITE
Description  N-channel TrenchPLUS standard level FET
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUK7C06-40AITE Datasheet(HTML) 3 Page - NXP Semiconductors

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BUK7C06-40AITE_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 16 February 2009
3 of 14
NXP Semiconductors
BUK7C06-40AITE
N-channel TrenchPLUS standard level FET
4.
Limiting values
[1]
Current is limited by power dissipation chip rating.
[2]
Continuous current is limited by package.
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
-
40
V
VDGR
drain-gate voltage
RGS =20kΩ
-40
V
VGS
gate-source voltage
-20
20
V
ID
drain current
Tmb =25°C; VGS =10V; see Figure 2; see Figure 3 [1]
-155
A
[2]
-75
A
Tmb =100 °C; VGS = 10 V; see Figure 2
[2]
-75
A
IDM
peak drain current
Tmb =25°C; tp ≤ 10 µs; pulsed; see Figure 3
-620
A
Ptot
total power dissipation
Tmb =25°C; see Figure 1
-272
W
IGS(CL)
gate-source clamping
current
continuous
-
10
mA
pulsed; tp =5ms; δ =0.01
-
50
mA
Visol(FET-TS
D)
FET to temperature
sense diode isolation
voltage
-100
100
V
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Source-drain diode
IS
source current
Tmb =25°C
[1]
-155
A
[2]
-75
A
ISM
peak source current
tp ≤ 10 µs; pulsed; Tmb =25°C
-
620
A
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source avalanche
energy
ID =75A; Vsup ≤ 40 V; RGS =50 Ω; VGS =10V;
Tj(init) = 25 °C; unclamped
-1.46
J
Electrostatic discharge
Vesd
electrostatic discharge
voltage
HBM; C = 100 pF; R = 1.5 k
-6
kV


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