TRF37A73

SLASE39 – MAY 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Input voltage

–0.3

3.6

V

Input Power

10

dBm

Operating virtual junction temperature range

–40

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC

–1

1

kV

Electrostatic discharge

Charged device model (CDM), per JEDEC

–1

1

kV

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3

3.3

3.45

V

–40

125

°C

6.4 Thermal Information

DSG

UNIT

8 PINS

Junction-to-ambient thermal resistance

79.3

Junction-to-case (top) thermal resistance

110

Junction-to-board thermal resistance

49

°C/W

Junction-to-top characterization parameter

6

Junction-to-board characterization parameter

49.4

Junction-to-case (bottom) thermal resistance

19.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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