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MAX6400BS__-T Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX6400BS__-T Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 9 page PARTS TOP MARK PARTS TOP MARK PARTS TOP MARK MAX6400BS31-T AAJ MAX6401BS31-T ABV MAX6402BS31-T ACF MAX6400BS30-T AAI MAX6401BS30-T ABU MAX6402BS30-T ACE MAX6400BS29-T AAH MAX6401BS29-T ABT MAX6402BS29-T ACD MAX6400BS28-T AAG MAX6401BS28-T ABS MAX6402BS28-T ACC MAX6400BS27-T AAF MAX6401BS27-T ABR MAX6402BS27-T ACB MAX6400BS26-T AAE MAX6401BS26-T ABQ MAX6402BS26-T ACA MAX6400BS25-T AAD MAX6401BS25-T ABP MAX6402BS25-T ABZ MAX6400BS24-T AAC MAX6401BS24-T ABO MAX6402BS24-T ABY MAX6400BS23-T AAB MAX6401BS23-T ABN MAX6402BS23-T ABX MAX6400BS22-T AAA MAX6401BS22-T ABM MAX6402BS22-T ABW PARTS TOP MARK PARTS TOP MARK PARTS TOP MARK MAX6403BS46-T ACT MAX6404BS46-T ADH MAX6405BS46-T ADV MAX6403BS45-T ACS MAX6404BS45-T ADG MAX6405BS45-T ADU MAX6403BS44-T ACR MAX6404BS44-T ADF MAX6405BS44-T ADT MAX6403BS43-T ACQ MAX6404BS43-T ADE MAX6405BS43-T ADS MAX6403BS42-T ACP MAX6404BS42-T ADD MAX6405BS42-T ADR MAX6403BS41-T ACO MAX6404BS41-T ADC MAX6405BS41-T ADQ MAX6403BS40-T ACN MAX6404BS40-T ADB MAX6405BS40-T ADP MAX6403BS39-T ACM MAX6404BS39-T ADA MAX6405BS39-T ADO MAX6403BS38-T ACL MAX6404BS38-T ACZ MAX6405BS38-T ADN MAX6403BS37-T ACK MAX6404BS37-T ACY MAX6405BS37-T ADM MAX6403BS36-T ACJ MAX6404BS36-T ACX MAX6405BS36-T ADL MAX6403BS35-T ACI MAX6404BS35-T ACW MAX6405BS35-T ADK MAX6403BS34-T ACH MAX6404BS34-T ACV MAX6405BS34-T ADJ MAX6403BS33-T ACG MAX6404BS33-T ACU MAX6405BS33-T ADI Table 2. Device Marking Codes µP Supervisory Circuits in 4-Bump (2 ✕ 2) Chip-Scale Package 8 _______________________________________________________________________________________ UCSP Reliability The chip-scale package (UCSP) represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliabil- ity tests. CSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a CSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater considera- tion for a CSP package. CSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Information on Maxim’s qualification plan, test data, and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at www.maxim-ic.com. |
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