IRS2001(S)PbF

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2

Symbol

Definition

Min.

Max.

Units

High-side floating supply voltage

-0.3

225

High-side floating supply offset voltage

High-side floating output voltage

Low-side and logic fixed supply voltage

-0.3

25

Low-side output voltage

-0.3

Logic input voltage (HIN & LIN)

-0.3

Allowable offset supply voltage transient

—

50

V/ns

(8 lead PDIP)

—

1.0

(8 lead SOIC)

—

0.625

Thermal resistance, junction to ambient

(8 lead PDIP)

—

125

(8 lead SOIC)

—

200

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

W

°C/W

V

°C

Symbol

Definition

Min.

Max.

Units

High-side floating supply absolute voltage

High-side floating supply offset voltage

Note 1

200

High-side floating output voltage

Low-side and logic fixed supply voltage

10

20

Low-side output voltage

0

Logic input voltage (HIN & LIN)

0

Ambient temperature

-40

125

Tip DT97-3 for more details).

Recommended Operating Conditions

The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the

°C

V