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ADC32J23IRGZR Datasheet(PDF) 6 Page - Texas Instruments |
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ADC32J23IRGZR Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 85 page  ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.4 Thermal Information ADC32J2x THERMAL METRIC(1) RGZ (VQFN) UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 25.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18.9 °C/W RθJB Junction-to-board thermal resistance 3.0 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, Maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUT Differential input full-scale 2.0 VPP Input resistance Differential at dc 6.5 k Ω Input capacitance Differential at dc 5.2 pF VCM common-mode voltage output 0.95 V VCM output current capability 10 mA Input common-mode current Per analog input pin 1.5 µA/MSPS 50- Ω differential source driving 50-Ω Analog input bandwidth (3 dB) 450 MHz termination across INP and INM DC ACCURACY Offset error –20 20 mV Gain error as a result of internal EG(REF) –3 3 %FS reference inaccuracy alone EG(CHAN) Gain error of channel alone ±1 %FS Temperature coefficient of EG(CHAN) –0.017 Δ%FS/°C CHANNEL-TO-CHANNEL ISOLATION fIN = 10 MHz 105 dB fIN = 100 MHz 105 dB Crosstalk fIN = 200 MHz 105 dB fIN = 230 MHz 105 dB fIN = 300 MHz 105 dB 6 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 |
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