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MAX604ESA Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX604ESA Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 12 page air, θJB (or θJC) is the thermal resistance of the package chosen, and θBA is the thermal resistance through the printed circuit board, copper traces and other materials to the surrounding air. The 8-pin SOIC package for the MAX603/MAX604 features a special lead frame with a lower thermal resistance and higher allowable power dissipation. The thermal resistance of this package is θJB = 42°C/W, compared with θJB = 110°C/W for an 8- pin plastic DIP package and θJB = 125°C/W for an 8-pin ceramic DIP package. The GND pins of the MAX603/MAX604 SOIC package perform the dual function of providing an electrical con- nection to ground and channeling heat away. Connect all GND pins to ground using a large pad or ground plane. Where this is impossible, place a copper plane on an adjacent layer. The pad should exceed the dimensions in Figure 4. Figure 4 assumes the IC is an 8-pin SOIC package, is soldered directly to the pad, has a +125°C maximum junction temperature and a +25°C ambient air tempera- ture, and has no other heat sources. Use larger pad sizes for other packages, lower junction temperatures, higher ambient temperatures, or conditions where the IC is not soldered directly to the heat-sinking ground pad. The MAX603/MAX604 can regulate currents up to 500mA and operate with input voltages up to 11.5V, but not simultaneously. High output currents can only be sustained when input-output differential voltages are low, as shown in Figure 5. Maximum power dissipation depends on packaging, board layout, temperature, and air flow. The maximum output current is: where PMAX is derived from Figure 4. Reverse-Current Protection The MAX603/MAX604 has a unique protection scheme that limits reverse currents when the input voltage falls below the output. It monitors the voltages on IN and OUT and switches the IC’s substrate and power bus to I P T - T V - V 100 C OUT max MAX J A IN OUT () = × () () ×° 5V/3.3V or Adjustable, Low-Dropout, Low IQ, 500mA Linear Regulators 8 _______________________________________________________________________________________ 0 100 200 300 400 500 600 700 27 MAX604 SUPPLY VOLTAGE (V) 5 39 810 12 11 6 413 CERAMIC DIP PLASTIC DIP HIGH-POWER SOIC MAXIMUM CONTINUOUS CURRENT LIMIT OPERATING REGION AT TA = +25°C TJ = +125°C 0 100 200 300 400 500 600 700 7 MAX603 MAXIMUM OUTPUT CURRENT vs. SUPPLY VOLTAGE SUPPLY VOLTAGE (V) 59 810 12 11 6 413 CERAMIC DIP PLASTIC DIP HIGH-POWER SOIC MAXIMUM CONTINUOUS CURRENT LIMIT OPERATING REGION AT TA = +25°C TJ = +125°C Figure 5. Power Operating Regions: Maximum Output Current vs. Differential Supply Voltage 1.0 1 0.2 10 20 6.5 1.3 (in2) (cm2) 65 130 POWER DISSIPATION vs. GROUND PAD AREA 1.2 COPPER GROUND PAD AREA 1.4 1.6 1.8 1.1 1.3 1.5 1.7 MAX603, VOUT = 5V 8-PIN SO PACKAGE PAPER EPOXY BOARD SINGLE SIDED 1oz. COPPER TJ = +125°C TA = +25°C STILL AIR Figure 4. Typical Maximum Power Dissipation vs. Ground Pad Size. |
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